Advanced PCB technology

• Blind vias

• Microvias

  • < 0.1mm diameter
  • Laser drilled or photoetched

• 50µm traces and spacing

• PCB BGA packages

8-layer board with BGA connections mounted on a 6-layer motherboard

8-layer board: Photoetched microvias

6-layer board: Laser drilled microvias

Alivh ? any-layer inner via hole

Application: Digital cell phone

Source: IEEE Spectrum, 10/99

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