PCB BGA

• Advantages

  • Low dielectric constant (~4)
  • Mature technology
  • Low resistance wires

• Disadvantages

  • CTE to IC
  • Traces too wide
  • Trace spacing too wide
  • Vias too big

• Huge technology push...

Source: IEEE Spectrum, 10/99

Chip has 2100 solder bumps

BGA has 570 solder balls

Chip is 11mm on a side

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