Mondays, 12:30-13:30, Room CSE203.
A discussion leader does not need to prepare a full presentation, just 2-3 slides with the summary and discussion points. Focus on what we should all think about!
Date | Discussion Leader | Paper |
April 1 | Luis/Mark. | Organizational Meeting, paper assignments, bad jokes. |
April 8 | Guest talk by Gabe Loh, Fellow at AMD. | Memory Organizations for 3D Die Stacking |
April 15 | Brandon Holt and Brandon Myers | Hardware Support for Fine-Grained Event-Driven Computation in Anton 2 |
April 22 | Eric and Irene | HOTL: a Higher Order Theory of Locality |
April 29 | Jacob and Mike R | Discerning the dominant out-of-order performance advantage: is it speculation or dynamism? |
May 6 | Adriana and Naveen | Cache Coherence for GPU Architectures |
May 13 | Thierry and Peter H | Stabilizer: Statistically Sound Performance Evaluation |
May 20 | Ethan and Katelin and Jianli |
Navigating Heterogeneous Processors with Market Mechanisms
Why You Should Care About Quantile Regression |
|
Memorial day. | Reflect. | Jun 3 | Adrian and Andre | Power Containers: An OS Facility for Fine-Grained Power and Energy Management on Multicore Servers |
by Gabriel Loh
Abstract: This talk provides a brief overview of die-stacking technologies, covering some of the different options out there for stacking. I will then focus on architectural approaches for 3D-stacked memories, as this is one of the first major application areas of die stacking. For markets that require significant memory capacity and upgradable memory, die-stacked DRAM alone will not be sufficient, which creates technical challenges for the architecture and overall system organization. This talk will focus on techniques to integrate the stacked memory in a software-transparent fashion, but we will also discuss challenges and open research directions for exposing the heterogeneity of this kind of memory system to the software stack.
Bio: Gabriel H. Loh is a Fellow Design Engineer in AMD Research, the research and advanced development lab for Advanced Micro Devices, Inc. Gabe received his Ph.D. and M.S. in computer science from Yale University in 2002 and 1999, respectively, and his B.Eng. in electrical engineering from the Cooper Union in 1998. Gabe was also a tenured associate professor in the College of Computing at the Georgia Institute of Technology, a visiting researcher at Microsoft Research, and a senior researcher at Intel Corporation. He is a senior member of IEEE and the ACM, (co-)inventor on over forty US patent applications, and a recipient of the US National Science Foundation Young Faculty CAREER Award. His interests include computer architecture, processor microarchitecture, memory systems, emerging technologies, 3D die stacking, sushi, ice hockey, and snowboarding.